Yingchuang Li releases a brand new 8-layer 2nd order Bluetooth headphone circuit board, leading a new era of wireless listening
- Release time: May 30, 2024
- Author: Founder
hello everyone! I am Lili
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The company's products!
Brand new 8-layer 2nd order Bluetooth earphone circuit board
Small stature, big universe
Circuit boardIt is the core component inside Bluetooth earphones, responsible for connecting various components and realizing wireless communication and audio processingKey componentsNext, Lili will take you to understand how the Bluetooth earphone system performs its powerful functions by "each performing its own duties" internally.
Bluetooth earphone circuit boardIt consists of multiple parts such as the main control chip, power amplifier chip, Bluetooth module, battery management chip, etc.
Main control chip: Bluetooth earphones“brain”Responsible for controlling the operation and data processing of the entire system.
Amplifier chip: responsible for amplifying and processing audio signals,ensuretone qualityClear.
Bluetooth module: It is used to implement BluetoothCommunicativekeyEnable Bluetooth earphones to connect with devices such as mobile phones.
Battery management chip: plays a role in managing battery charging, discharging, and protection, ensuring the use of Bluetooth earphones安全和稳定。
In addition, there are also someAuxiliary componentsThe components such as charging interface, button control, LED indicator light, etc. work together to form a complete Bluetooth earphone system.
Product Display
蓝牙耳机作为我们生活中不可或缺的智能配件，其内部结构的复杂程度着实让人叹为观止。公司推出的这款8层2阶蓝牙耳机线路板，设计精密，功能强大，极大提升了耳机整体性能，优化了用户体验，是无线耳机技术的一次重大飞跃。
Product Introduction
| Product Layers | 8th floor 2nd order |
| Product size | 26.52mm*5.21mm |
| Surface Treatment | ENIG (Sinking Gold) |
| Finished board thickness | 0.75±0.08mm |
| Assembly method | SMT |
| application area | Bluetooth headset |
| Product characteristics | 8th layer 2nd order stacked hole Bluetooth module product |
| Resin plug hole+laser stacked hole design | |
| 白色油墨最小阻焊桥75μm |
Laminated structure
性能优势
Advanced 8-layer design, compared to traditional 4-layer or 6-layer circuit boards, supports faster signal transmission, more stable connection performance, and lower electromagnetic interference, ensuring the purity and flawlessness of audio signals.
The introduction of second-order design at the same time makes the circuit board more compact in size while ensuring performance, providing greater creative space for headphone designers and bringing unprecedented high-quality auditory feast to music enthusiasts!
