Yingchuang Li releases SIP carrier board to support the rapid development of advanced packaging field
- Release time: June 8, 2024
- Author: Founder
Yingchuangli is deeply rooted in the electronic circuit industry, and with strong technological innovation capabilities and R&D manufacturing strength, it has entered the field of advanced packaging substrates in China, continuously promoting new breakthroughs in the domestic semiconductor industry chain. Recently, the company has made new breakthroughs in product research and development, and has launched an advanced packaged SIP Bluetooth module carrier board!
give birth toProduct display
Product size 14mm * 21mm, finished board thickness 0.55mm
Product Introduction
Number of layers | 4Level 1 |
Product size | 14mm*21mm |
Surface Treatment | NiPdAu |
Finished board thickness | 0.55mm |
base material | R04350B |
Solder mask color | green |
Minimum line width/line spacing | 3.9miles/10miles |
Laminated structure
小型化 
Integrating multiple components into a single package can save up to 65% of space, which is particularly advantageous for portable and wearable devices.
Thinning and thinning Reduce the number of discrete components required for design, reduce overall thickness by 33% -50%, and lower manufacturing costs.
Excellent heat dissipation The temperature inside the component drops by 9 ℃, achieving high performance and reliability, especially in high-power and high-density application scenarios.
高信噪比 The design layout is complex, the interconnected components are flexible, low-noise transmission, and effective reduction of 40% of signal interference and crosstalk.
