Yingchuang Li launches storage packaging carrier board

  • Release time: July 23, 2024
  • Author: Founder

四川英创力电子科技股份有限公司

Yingchuangli is the first domestic enterprise in the southwest region to enter the field of advanced packaging substrates. We have a modern IC carrier board production base, world leading automated production equipment, industry-leading production technology, and an experienced professional management team. Our annual production capacity is 100000 square meters.

四川英创力电子科技股份有限公司

Continuous burst of development vitality

Innovative momentum surges forward with full force

The company once again launches storage packaging carrier boards

四川英创力电子科技股份有限公司

四川英创力电子科技股份有限公司

四川英创力电子科技股份有限公司Physical display

四川英创力电子科技股份有限公司

四川英创力电子科技股份有限公司

四川英创力电子科技股份有限公司

四川英创力电子科技股份有限公司Layered design

四川英创力电子科技股份有限公司

四川英创力电子科技股份有限公司

四川英创力电子科技股份有限公司

四川英创力电子科技股份有限公司

Storage chip is a semiconductor chip used for storing data and information. It can retain stored data even after power failure and has memory function. The performance indicators of storage chips usually include storage capacity, read and write speed, data retention time, power consumption, etc.

四川英创力电子科技股份有限公司

For example, in our mobile phones, storage chips are used to store data such as photos, videos, applications, and system files. The hard drive or solid-state drive in a computer, whose core is also a storage chip, is used to store various information such as operating systems, documents, games, etc.

四川英创力电子科技股份有限公司

Storage type packaging carrier board is a substrate that plays a key supporting and connecting role in the packaging process of storage chips, realizing the electrical connection between storage chips and external circuits, providing physical support for storage chips, and ensuring the stability and reliability of chips after packaging.

四川英创力电子科技股份有限公司

四川英创力电子科技股份有限公司

四川英创力电子科技股份有限公司High precision wiring

The product adopts advanced laser X-hole copper plug technology with the smallest aperture0.1mmThe minimum line width and spacing are 30 μ m/30 μ m, meeting the requirements of high-speed and high bandwidth data transmission for storage chips.

四川英创力电子科技股份有限公司Good heat dissipation performance

Product size13.7mm×7.6mmFinished board thickness 0.25 ±0.05mmIt reduces the volume and weight of the entire storage module, providing good heat dissipation performance for the storage chip.

四川英创力电子科技股份有限公司Stable electrical performance

采用生产成本低、良率高的WB-BOC封装技术,为存储芯片提供稳定的电气连接,保证信号传输的稳定性和可靠性。

四川英创力电子科技股份有限公司High quality production materials

Adopting high-performance and high-quality SI10U domestically produced BT material to ensure the durability and functionality of the product.

四川英创力电子科技股份有限公司Excellent protective performance

采用ENIPIG(镍钯金)表面处理,为产品提供良好的机械强度、耐腐蚀性和可焊性,保证存储数据的准确性和可靠性。

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