SSD New Product Release! Leading the new transformation of storage technology!
- Release time: May 5, 2024
- Author: Founder
Yingchuangli adheres to independent innovation and maintains strong momentum
From double-sided and multi-layer boards with multiple varieties and fast delivery times
To any high-level HDI interconnect, IC carrier board
High quality acceleration in research and development!
New SSD products to be released in April
Leading the New Transformation of Storage Technology
Promote the leapfrog development of the digital age
Solid State Drive (SSD), as a new type of high-speed storage device,
With its high performance, low energy consumption, and high reliability,
It has been widely used in fields such as data centers, personal computers, and mobile devices.
Product Introduction
| Number of layers | 6th floor, 1st order |
| Product size | 22*80mm |
| Surface Treatment | 化金+电镀硬金 |
| Finished board thickness | 0.85±0.08mm |
| Assembly method | SMT |
| application area | Solid state storage such as computer servers and workstations |
| Product Features | |
① High frequency high-speed SSD storage board. ② The thickness of both the inner and outer layers of copper is 35 μ m. ③ 激光盲孔设计，层间偏移≤30μm，任意层偏≤50μm。 ④ Impedance control of 100 ± 10 Ω. ⑤ 表面处理采用选化工艺，焊盘选用化金，插拔金手指电镀硬金。 | |
As one of the core components of SSD, the performance and stability of the circuit board are directly related to the overall performance of SSD.
This SSD circuit board achieves a dual leap in performance and stability with outstanding technical strength and design advantages.
Layered design
01 高速数据传输
By adopting advanced interface and signal processing technologies, fast data transmission speeds are achieved, significantly improving the overall performance of the system.
02 稳定性与可靠性
经过严格的测试和优化，具备出色的稳定性和可靠性，确保数据的安全存储。
03 精湛工艺
体现了公司在电路设计和制造方面的精湛工艺，为高品质的 SSD 产品提供坚实支持。
04 节能特性
在提供高效性能的同时，有效降低能耗，对环境友好。
05 灵活适配
可广泛应用于各类 SSD 产品，满足不同用户的需求。
06 适用于各种场景
①高端计算机系统，为要求严苛的工作负载提供卓越的性能。
②游戏设备，使玩家尽享流畅的游戏体验。
③多媒体工作站，加速视频编辑和音频处理等任务。
