High thermal conductivity thick copper plate
1. The center position is equipped with a large gold surface mounted chip, and the bottom heat dissipation is conducted through a through-hole.
2. A row of 33 gold fingers for threading, totaling 132 gold fingers.
3. A row of 12 solder ball pads, totaling 144 pads.
4. Golden finger width CPK 4.08, pad width CPK 3.31.
5. Gold wire binding tensile test, determine ACC.
6. The minimum tensile force is 4.212g.
Product Introduction
| Number of layers | 16 |
| Finished board thickness | 3.75mm |
| Maximum copper thickness | Inner layer 5OZ |
| Tolerance | ±0.15mm |
| Tolerance of crimping hole | ±0.05mm |
| Characteristics | Blind holes, crimping holes, resin plug holes |
