Multi layer mixed pressure plate
1. The center position is equipped with a large gold surface mounted chip, and the bottom heat dissipation is conducted through a through-hole.
2. A row of 33 gold fingers for threading, totaling 132 gold fingers.
3. A row of 12 solder ball pads, totaling 144 pads.
4. Golden finger width CPK 4.08, pad width CPK 3.31.
5. Gold wire binding tensile test, determine ACC.
6. The minimum tensile force is 4.212g.
Product Introduction
| Number of layers | 20 |
| Finished board thickness | 5.7mm |
| material | PTFE+FR-4 |
| characteristic | 4th order blind hole+blind groove+buried resistance+back drilling+depth control half hole |
| There are surface treatments, wiring, solder mask, and characters inside the steps | |
| Multi layer buried resistor in the inner layer, with 8 different resistance values | |
| Multiple blind buried holes+blind/through hole back drilling |
