Multi layer high-speed board
1. The center position is equipped with a large gold surface mounted chip, and the bottom heat dissipation is conducted through a through-hole.
2. A row of 33 gold fingers for threading, totaling 132 gold fingers.
3. A row of 12 solder ball pads, totaling 144 pads.
4. Golden finger width CPK 4.08, pad width CPK 3.31.
5. Gold wire binding tensile test, determine ACC.
6. The minimum tensile force is 4.212g.
Product Introduction
Number of layers | 18 |
Finished board thickness | 4.0mm |
Minimum aperture | 0.20mm |
Thickness to diameter ratio | 20:1 |
Materials | Panasonic M6 material |
Characteristics | Characteristic impedance ± 7.5% (≤ 50 Ω) ± 5% (>50 Ω) |
Bidirectional back drilling, residual pile less than 0.08mm, resin plug hole | |
Transmission speed 64G bps |
