IC peelable frame
1. The center position is equipped with a large gold surface mounted chip, and the bottom heat dissipation is conducted through a through-hole.
2. A row of 33 gold fingers for threading, totaling 132 gold fingers.
3. A row of 12 solder ball pads, totaling 144 pads.
4. Golden finger width CPK 4.08, pad width CPK 3.31.
5. Gold wire binding tensile test, determine ACC.
6. The minimum tensile force is 4.212g.
Product Introduction
Single LED chip top electrode cap type peelable frame
Electrode column thickness | 70 ± 5 μ M |
Electrode column size | 220 ± 5 * 160 ± 5 μ M |
Surface flatness of mushroom head | ≥80% |
Mushroom head unilateral | 15μ M |
application area | Logic/Storage/Mini LED |
