Bluetooth module carrier board
1. The center position is equipped with a large gold surface mounted chip, and the bottom heat dissipation is conducted through a through-hole.
2. A row of 33 gold fingers for threading, totaling 132 gold fingers.
3. A row of 12 solder ball pads, totaling 144 pads.
4. Golden finger width CPK 4.08, pad width CPK 3.31.
5. Gold wire binding tensile test, determine ACC.
6. The minimum tensile force is 4.212g.
Product Introduction
| Number of layers | 4th floor, 1st order |
| Finished board thickness | 0.55mm |
| Product size | 14mm*21mm |
| Minimum line width/line spacing | 99.06 / 254 μ M |
| Surface Treatment | NiPdAu |
| Base material | R04350B |
| Solder mask color | green |
