近日，公司成功交付一款4层激光叠孔存储类芯片封装基板，凭借材料创新、散热设计及高密度互连三大核心技术突破，为消费电子、数据中心、AI算力等领域提供高性能封装解决方案，助力国产存储芯片产业创新发展。1.技术参数产品尺寸：18mm×7mm成品板厚：0.3±0.03mm表面处理：ENEPIG（镍钯金）组装...

Show off your confidence and create a technological future! The second Chengdu University of Information Science and Technology "Yingchuangli Cup" PCB design competition, hosted by the Academic Affairs Office of Chengdu University of Information Science and Technology, and organized by the School of Communication Engineering (School of Microelectronics) of Chengdu University of Information Science and Technology and Sichuan Yingchuangli Electronic Technology Co., Ltd., was a complete success. From the preparation and promotion of the competition, to the landing of the competition and the awarding of prizes, the entire competition lasted for more than two months and attracted nearly 200 students from majors such as communication, electronics, and automation ..

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