The first IC carrier board from Yingchuang Li has been shipped!
2025-07-05
英创力创新发展 实力开局载板事业部第一款IC载板出货！！ IC 载板（IC Package Substrate）是连接并传递裸芯片（DIE）与印刷电路板 (PCB)之间信号的载体，是封装测试环节中的关键，它是在PCB板的相关技术基础上发展而来的，用于建立 IC 与 PCB之间的讯号连接，起着“承上启...
New Product Release | Yingchuanli launches high-speed soft hard combination board
2025-07-05
Our company has launched a new product, high-speed soft hard composite board, with the development of "British" nuclear technology and the creation of "new" strength!
