In the 5G era, the integration of driving devices has skyrocketed, and the motherboard architecture urgently needs to be innovated. Ordinary HDI is accelerating its iteration towards Anylayer HDI and SLP technology to meet the high-density integration requirements of multiple devices.

Recently, the company achieved a significant technological breakthrough in the field of high-density interconnect (HDI) and launched12 layer 4th order digital human interaction integrated machine motherboardIt can meet the higher demands of 5G terminals for signal transmission, heat dissipation efficiency, and integration.

High precision process ensures stable performance

Using laser blind hole stacking technology to accurately connect various layers of circuits. The measured data shows that the interlayer offset is controlled within 20 μ m (customer requirement ≤ 50 μ m). The filling hole depression is only 4.8 μ m (customer requirement ≤ 10 μ m), effectively reducing signal transmission loss. By optimizing impedance control (tolerance ± 5 Ω), ensure the stability of high-speed data transmission.

High frequency materials assist 5G communication

The motherboard uses low loss high-frequency substrate with a loss factor of less than 0.005, supporting millimeter wave frequency band signal transmission. The power layer and ground layer adopt a symmetrical layout design, achieving high-density integration in a compact size of 70mm × 66mm, which can provide reliable support for functions such as multiple cameras and wireless charging.

Lightweight design adapted to terminal innovation

The board thickness is only 0.8mm ± 0.08mm, with a weight reduction of 15% compared to similar products. It meets the IPC-6012 Class III standard and is compatible with the latest packaging technology, helping manufacturers achieve thinner and lighter 5G terminal designs.