2.4G four layer DDR4 development board
The single board is a 4-layer development board for verifying DDR4, supporting various ultra high speed and ultra high definition interfaces. DDR4 has a minimum speed of 2.4G and a maximum speed of 3.2G.
77G radar development board
Our company has rich experience and capabilities in radar systems and millimeter wave RF design. With a small enough size, we can meet the high performance requirements of our customers and assist them in completing very high reliability design, verification, testing, and calibration.
48 layer supercomputer board
The cost of single board components has reached nearly 2 million yuan. In the case of structural limitations and long-distance connection of multiple buckle boards, our company successfully delivered the first version through preliminary simulation to meet customer design requirements.
Superconducting quantum computing board
The multi-channel high-density quantum computing chip packaging system is jointly developed by our company and a certain university. The system is a sample installation and testing system based on multi-channel high-density coaxial connectors and low-temperature non-magnetic PCBs. Mainly used for packaging and connecting multi bit quantum computing chips, extremely low temperature testing of superconducting quantum computing chips, breaking the monopoly of IBM and Google.
2.4G four layer DDR4 development board
The single board is a 4-layer development board for verifying DDR4, supporting various ultra high speed and ultra high definition interfaces. DDR4 has a minimum speed of 2.4G and a maximum speed of 3.2G.
77G radar development board
Our company has rich experience and capabilities in radar systems and millimeter wave RF design. With a small enough size, we can meet the high performance requirements of our customers and assist them in completing very high reliability design, verification, testing, and calibration.
48 layer supercomputer board
The cost of single board components has reached nearly 2 million yuan. In the case of structural limitations and long-distance connection of multiple buckle boards, our company successfully delivered the first version through preliminary simulation to meet customer design requirements.
Superconducting quantum computing board
The multi-channel high-density quantum computing chip packaging system is jointly developed by our company and a certain university. The system is a sample installation and testing system based on multi-channel high-density coaxial connectors and low-temperature non-magnetic PCBs. Mainly used for packaging and connecting multi bit quantum computing chips, extremely low temperature testing of superconducting quantum computing chips, breaking the monopoly of IBM and Google.
High definition CMOS
A unit in the western region has commissioned our company to develop a high-definition shooting system that can capture over 7000 images per second.
Neutron testing platform
Our company and a certain university jointly developed a neutron capture testing system for a research institute, which is extremely strict on product materials and weak signals. Our engineers combine multiple resources to perfectly achieve customer product functionality.
Bearing detection system
From the bidding of a certain group to the project confirmation, our R&D team worked hard on the front line, challenged new solutions, and completed the overall R&D and delivery of the project in just two and a half months, greatly reducing the customer's project development time and cost.
Central control FPGA platform
This project is an update and iteration of the central control platform system for a radio station in East China. After discussing with our company, we have decided to launch the development of a new FPGA platform. We will gradually complete the customer's product iteration within six months without affecting their normal use, greatly enhancing their operational experience and platform stability.