Product Introduction
| Number of layers | 8th floor 2nd order |
| Product size | 6.52mm*5.21mm |
| Surface Treatment | ENIG (Sinking Gold) |
| Finished board thickness | 0.75±0.08mm |
| Assembly method | SMT |
| application area | Bluetooth headset |
| Product characteristics | 8th layer 2nd order stacked hole Bluetooth module Resin plug hole+laser stacked hole design with white ink minimum solder bridge of 75 μ m |
